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Finfet/Gaa Modeling for IC Simulation and Design - 2nd Edition (Paperback) - 1 of 1

Finfet/Gaa Modeling for IC Simulation and Design - 2nd Edition (Paperback)

$130.99

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About this item

Highlights

  • FinFET/GAA Modeling for IC Simulation and Design: Using the BSIM-CMG Standard, Second Edition is the first to book to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture as now enabled by the approved industry standard.
  • Author(s): Yogesh Singh Chauhan & Chenming Hu & S Salahuddin & Girish Pahwa & Avirup Dasgupta & Darsen Lu & Sriramkumar Vanugopalan & Ali M Niknejad & Sourabh Khandelwal & Juan Pablo Duarte & Navid Payvadosi
  • 324 Pages
  • Technology, Construction

Description



Book Synopsis



FinFET/GAA Modeling for IC Simulation and Design: Using the BSIM-CMG Standard, Second Edition is the first to book to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture as now enabled by the approved industry standard. The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, thus providing a step-by-step approach for the efficient extraction of model parameters.

With this book, users will learn Why you should use FinFET, The physics and operation of FinFET Details of the FinFET standard model (BSIM-CMG), Parameter extraction in BSIM-CMG FinFET circuit design and simulation, and more.

Dimensions (Overall): 9.3 Inches (H) x 7.4 Inches (W) x .5 Inches (D)
Weight: 1.45 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 324
Genre: Technology
Sub-Genre: Construction
Publisher: Academic Press
Theme: General
Format: Paperback
Author: Yogesh Singh Chauhan & Chenming Hu & S Salahuddin & Girish Pahwa & Avirup Dasgupta & Darsen Lu & Sriramkumar Vanugopalan & Ali M Niknejad & Sourabh Khandelwal & Juan Pablo Duarte & Navid Payvadosi
Language: English
Street Date: August 28, 2024
TCIN: 1011123623
UPC: 9780323957298
Item Number (DPCI): 247-44-3933
Origin: Made in the USA or Imported
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Shipping details

Estimated ship dimensions: 0.5 inches length x 7.4 inches width x 9.3 inches height
Estimated ship weight: 1.45 pounds
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Q: What topics does this book cover regarding FinFET technology?

submitted by AI Shopping Assistant - 29 days ago
  • A: The book covers FinFET physics, operation, BSIM-CMG model specifics, and parameter extraction procedures for circuit design and simulation.

    submitted byAI Shopping Assistant - 29 days ago
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Q: What type of binding does this book have?

submitted by AI Shopping Assistant - 29 days ago
  • A: The book is available in a paperback format, providing durability and ease of use.

    submitted byAI Shopping Assistant - 29 days ago
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Q: How many pages are in this book?

submitted by AI Shopping Assistant - 29 days ago
  • A: The book consists of a total of 324 pages, offering comprehensive coverage of its topics.

    submitted byAI Shopping Assistant - 29 days ago
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Q: What is the target audience for this book?

submitted by AI Shopping Assistant - 29 days ago
  • A: This book is aimed at individuals 22 years and older, particularly those in technology and engineering fields.

    submitted byAI Shopping Assistant - 29 days ago
    Ai generated

Q: Who are the co-authors of this book?

submitted by AI Shopping Assistant - 29 days ago
  • A: The book is co-authored by multiple experts including Chenming Hu, S Salahuddin, and several others.

    submitted byAI Shopping Assistant - 29 days ago
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