Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging.
Author(s): Milton Ohring & Lucian Kasprzak
758 Pages
Technology, Materials Science
Description
About the Book
"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"--
Book Synopsis
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
Dimensions (Overall): 9.0 Inches (H) x 6.0 Inches (W) x 1.56 Inches (D)
Weight: 2.59 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 758
Genre: Technology
Sub-Genre: Materials Science
Publisher: Academic Press
Theme: General
Format: Hardcover
Author: Milton Ohring & Lucian Kasprzak
Language: English
Street Date: December 1, 2014
TCIN: 1008939325
UPC: 9780120885749
Item Number (DPCI): 247-21-5513
Origin: Made in the USA or Imported
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Shipping details
Estimated ship dimensions: 1.56 inches length x 6 inches width x 9 inches height
Estimated ship weight: 2.59 pounds
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