Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore - Woodhead Publishing Electronic and Optical Materials Paperback

Name: Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore - (Woodhead Publishing Electronic and Optical Materials) (Paperback)
Brand: Woodhead Publishing
SKU: 1008782563
Price: 235.00 USD
Availability: InStock

undefined out of 5 stars with 0 reviews

$235.00

In Stock

Eligible for registries and wish lists

About this item

Highlights

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D.
Author(s): Hengyun Zhang & Faxing Che & Tingyu Lin & Wensheng Zhao
434 Pages
Technology, Electronics
Series Name: Woodhead Publishing Electronic and Optical Materials

Description

Book Synopsis

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Dimensions (Overall): 9.0 Inches (H) x 6.0 Inches (W) x .89 Inches (D)

Weight: 1.28 Pounds

Suggested Age: 22 Years and Up

Number of Pages: 434

Genre: Technology

Sub-Genre: Electronics

Series Title: Woodhead Publishing Electronic and Optical Materials

Publisher: Woodhead Publishing

Theme: Digital

Format: Paperback

Author: Hengyun Zhang & Faxing Che & Tingyu Lin & Wensheng Zhao

Language: English

Street Date: November 15, 2019

TCIN: 1008782563

UPC: 9780081025321

Item Number (DPCI): 247-24-3294

Origin: Made in the USA or Imported

If the item details aren’t accurate or complete, we want to know about it.

Shipping details

Estimated ship dimensions: 0.89 inches length x 6 inches width x 9 inches height

Estimated ship weight: 1.28 pounds

We regret that this item cannot be shipped to PO Boxes.

This item cannot be shipped to the following locations: American Samoa (see also separate entry under AS), Guam (see also separate entry under GU), Northern Mariana Islands, Puerto Rico (see also separate entry under PR), United States Minor Outlying Islands, Virgin Islands, U.S., APO/FPO