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MEMS Packaging Technologies and 3D Integration - (Hardcover) - 1 of 1

MEMS Packaging Technologies and 3D Integration - (Hardcover)

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Highlights

  • This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
  • 210 Pages
  • Science, Life Sciences

Description



Book Synopsis



This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Dimensions (Overall): 9.61 Inches (H) x 6.69 Inches (W) x .69 Inches (D)
Weight: 1.44 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 210
Genre: Science
Sub-Genre: Life Sciences
Publisher: Mdpi AG
Theme: Biology
Format: Hardcover
Language: English
Street Date: June 1, 2022
TCIN: 1010788984
UPC: 9783036542584
Item Number (DPCI): 247-36-4291
Origin: Made in the USA or Imported
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Shipping details

Estimated ship dimensions: 0.69 inches length x 6.69 inches width x 9.61 inches height
Estimated ship weight: 1.44 pounds
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Q: What is the primary audience for this book?

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  • A: The suggested age for this book is 22 years and up, indicating a focus on advanced readers.

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Q: How many pages does the book contain?

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  • A: The book contains a total of 210 pages.

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Q: What is the format of the book?

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  • A: The book is available in hardcover format.

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Q: Who is the publisher of this book?

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  • A: The book is published by Mdpi AG.

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Q: What topics are covered in this book?

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  • A: The book covers biocompatible packaging, interconnect technologies, bonding methods, vacuum packaging, and modeling simulations.

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