This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
210 Pages
Science, Life Sciences
Description
Book Synopsis
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
Dimensions (Overall): 9.61 Inches (H) x 6.69 Inches (W) x .69 Inches (D)
Weight: 1.44 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 210
Genre: Science
Sub-Genre: Life Sciences
Publisher: Mdpi AG
Theme: Biology
Format: Hardcover
Language: English
Street Date: June 1, 2022
TCIN: 1010788984
UPC: 9783036542584
Item Number (DPCI): 247-36-4291
Origin: Made in the USA or Imported
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Shipping details
Estimated ship dimensions: 0.69 inches length x 6.69 inches width x 9.61 inches height
Estimated ship weight: 1.44 pounds
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